MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G
http://onsemi.com
5
PACKAGE DIMENSIONS
SC?70 (SOT?323)
CASE 419?04
ISSUE N
A
A2
D
e1
b
e
E
A1
c
L
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.05 (0.002)
1.9
0.075
0.65
0.025
0.65
0.025
0.9
0.035
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.80 0.90 1.00 0.032
INCHES
A1
0.00 0.05 0.10 0.000
A2
0.70 REF
b
0.30 0.35 0.40 0.012
c
0.10 0.18 0.25 0.004
D
1.80 2.10 2.20 0.071
E
1.15 1.24 1.35 0.045
e
1.20 1.30 1.40 0.047
0.035 0.040
0.002 0.004
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
NOM MAX
L
2.00 2.10 2.40 0.079
0.083 0.095
HE
e1
0.65 BSC
0.20 0.560.38
0.028 REF
0.026 BSC
0.015
0.008
0.022
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
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MMBD330T1/D
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